OREANDA-NEWS. Air Products (NYSE:APD) will feature its advanced copper barrier slurries for the electronics industry at the International Conference on Planarization Technology (ICPT), being held at the Wild Pass Horse Hotel & Casino in Chandler, Ariz., from September 30-October 2.

As part of the conference’s Technical Sessions, Air Products will present a paper titled “Attributes of an Advanced Node Copper Barrier Slurry” on Wednesday, September 30, at 9:35 a.m. in the Ironwood Room. The work highlights a new barrier slurry formulation that significantly boosts overall removal rates through the use of chemical additives combined with an optimized abrasive, resulting in increased removal rates and reduced defects compared to current commercial offerings.

“As a result of this research, post barrier CMP planarity, specifically density array erosion, is improved by varying the specific barrier slurry removal rate ratios in a controllable fashion,” said Jim Schlueter, Air Products’ advanced barrier technology manager, who is presenting the technical paper. “Compared to existing products, the new barrier slurries offer major improvements in demonstrating significant array erosion improvement and provide device makers tunability and enhanced planarity, along with reduced defects,” added Schlueter.

In addition to the technical paper, Air Products will also participate in the following poster sessions at ICPT. 

  • “Improved Performance of Air Product STI2100TM Calcined Ceria Slurry for Advanced Node Applications”
  • “Low Dishing Cu CMP Slurries for Advances Node Applications”
  • “Advanced High Rate, Neutral pH Tungsten Slurries”
  • “Post-STI CMP Buff Cleaning to Reduce Defectivity”

ICPT conference attendees are invited to meet with an Air Products scientist or representative in Chandler to discuss their specific challenges with CMP or post CMP cleans.