OREANDA-NEWS. August 06, 2015.  Mushkin Enhanced MFG, a leading designer and manufacturer of high-performance computer innovations and solutions, today announced availability of its new high-performance Redline and Blackline Ridgeback memory lines. Originally unveiled at CES 2015, the newly refreshed Ridgeback heatsink is cut from aircraft-grade anodized aluminum, improving heat dissipation and giving users the performance edge they need to eliminate the competition.

Officially scheduled to launch with Mushkin’s new performance DDR4 memory, each module is hand tested and validated on motherboards from all the major manufacturers. The New Ridgeback DDR4 modules feature XMP 2.0 profiles to deliver easy, reliable overclocking performance with the Intel® X99 platforms and the latest Intel® Core™ i7 Skylake family of processors.

The new Redline and Blackline Ridgeback DDR4 memory kits incorporate a striking, industrial design for improved aesthetics and cool operation. Redline and Blackline Ridgeback memory kits are built with hand-screened DRAM, undergo rigorous testing, and incorporate state-of-the-art cooling for reliable performance in demanding environments.

"We're very excited to release the new Ridgeback heatsinks. As we revamp our performance module heatsinks, we’re using the opportunity to deliver a capable thermal management solution while updating our Blackline and Redline series with an edgy, modern design," said Brian Flood, Director of Product Development at Mushkin Inc. “Our designs always have a purpose and we’re pleased to be able to improve our products’ look and functionality”

The new Ridgeback heatsink design will be an exhilarating change as the Ridgeback’s slick and eye-catching silhouette will allow your machine to run smoothly and in style.