OREANDA-NEWS. May 19, 2015. Note that the releases are accurate at the time of publication but may be subject to change without notice.
Product Features| 1) |
Reduced power loss thanks to seventh-generation IGBT and seventh-generation diode
| - | Seventh-generation CSTBT1TMchip achieves low power loss and low EMI noise. |
| - | Relaxed Field of Cathode (RFC) diode2 chip incorporating new backside diffusion process achieves low power loss and suppression of recovery-voltage surge. |
| 1 |
Mitsubishi Electric's original IGBT chip construction incorporating carrier-store effect |
| 2 |
P layer is added partially on cathode side and the hole is injected during recovery term to soften the recovery waveform and to suppress the surge voltage (only for 1200V rating). |
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| 2) |
Reliability of de facto standard package are improved by latest package technology
| - | The internal structure is improved, keeping compatibility with de facto standard package. |
| - | Integration of insulation and copper base in the substrate, along with improved internal electrode construction, helps to increase thermal cycle life3 and lower internal inductance, leading to more reliable equipment performance. |
| 3 |
The life proven in a stress test of relatively long-term temperature cycling between two case temperature |
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Sample Shipments
| Package |
Voltage Rating |
Current Rating |
Shipment |
NX-type
Solder Pin Package |
650V |
100, 150, 200, 300, 450, 600A |
From June 30 |
| 1200V |
100, 150, 200, 225, 300, 450, 600, 1000A |
NX-type
Press Fit Pin Package |
650V |
100, 150, 200, 300, 450, 600A |
| 1200V |
100, 150, 200, 225, 300, 450, 600, 1000A |
Standard-type
Package |
650V |
100, 150, 200, 300, 400, 600A |
| 1200V |
100, 150, 200, 300, 450, 600A |
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