OREANDA-NEWS. Mitsubishi Electric Corporation announced the launch of its 1,200V large transfer-mold dual in-line package intelligent power module (DIPIPMTM) Ver.6 and 1,200V Mini DIPIPM using sixth-generation IGBT chips featuring the carrier-stored trench-gate bipolar transistor (CSTBTTM) structure.

Both modules reduce the power consumption, size and weight of inverter systems for motors used in air conditioners and industrial applications. Sales begin September 30.

The new models will be exhibited at MOTORTECH JAPAN 2014 during TECHNO-FRONTIER 2014 at Tokyo Big Sight in Japan from July 23 to 25.