OREANDA-NEWS. Panasonic Corporation announced that it has set up a research and development center in Singapore to reinforce overseas R&D on encapsulation materials mainly used for power devices. The center, provisionally named the Electronic Materials South Asia R&D Center, has been established under the umbrella of Panasonic Industrial Devices Materials Singapore Pte. Ltd. (PIDMSG).

Panasonic has a wide range of core technologies from materials to devices and systems, which gives the company a competitive advantage in proposing B2B solutions across a variety of industries. In the electronic materials business, Panasonic makes the best of its expertise in materials development, processing and quality evaluation analysis to offer an extensive range of products, including circuit board materials, encapsulation materials and plastic molding compound.

Recently, in the field of power devices, whose demand is expected to grow in the future, many customers are expanding their assembly operations in the Southeast Asian region and setting up functions to procure encapsulation materials and conduct R&D at their key sites in Singapore and Malaysia. To support such customers effectively from a geographically closer location, Panasonic has decided to establish an R&D center specialized in encapsulation materials on the premises of PIDMSG. Panasonic will continue to enhance its ability to support customers through the new R&D center.

Mainly focusing on encapsulation materials for power modules, power discrete semiconductors and Power ICs, the company will expand product development and technical services in Singapore to provide tailored services that meet customer demand in Southeast Asia. With the locally-based services, Panasonic aims to increase the sales of encapsulation materials in Southeast Asia.