OREANDA-NEWS. July 19, 2011. Second package in the SimPRESSO series, which enables easy analysis of electronic components

Tokyo and Nagano, July 19, 2011 — Fujitsu Limited and Fujitsu Nagano Systems Engineering Limited today announced the release of SimPRESSO/RFL, a new software package in Japan that enables easy analysis of the temperature distribution in the reflow soldering(1) process of electronic components. The new package is designed for manufacturers of components such as electronic car parts and devices.

SimPRESSO/RFL is the second package in the SimPRESSO software series, which enables easy analysis of electronic components simply by following on-screen instructions. The release of the first package, which is designed to facilitate the analysis of heat-related distortion in printed circuit boards, was announced in January 2011.

While skillful techniques for adjusting the heating temperature are essential in preventing heat damage to electronic components in the reflow soldering process, SimPRESSO/RFL enables details of the temperature distribution to be confirmed at a glance, allowing users to immediately ascertain the optimal heating temperature and heating time. As a result, in addition to enabling customers to compress their development times and improve the quality of built-in components, the new package also helps to achieve significant cost savings by reducing the number of observation cycles performed with test components.