OREANDA-NEWS. July 11, 2011. Tokyo Electron Limited (TEL) today announced three new 300 mm surface preparation products which will become commercially available in July. CELLESTA™ -i, a new single wafer processing platform, NS300+ HT, a higher throughput version of TEL’s successful scrubber series, and EXPEDIUS™ -i, TEL’s latest auto wet station. These products were developed to provide customers with high productivity, significantly lower CoO, easier maintenance, higher yield, and improved process performance for next generation technologies.

 The CELLESTA -i achieves a throughput of 1,000 wph. Independent zones allow maintenance to occur in one zone while the other continues processing wafers. The product can be used for a variety of FEOL and BEOL process applications, including resist stripping, backside and bevel cleaning. The product features parallel wafer processing, controlled chamber ambient with low O2, compatibility with aggressive chemistries, and an automated chamber/exhaust cleaning system.

 EXPEDIUS -i, with a throughput of 1,000 wph, is TEL’s latest auto wet station offering for high production batch wafer surface preparation. Production has been enhanced through new development in tank and dryer design and new process capability to achieve higher process throughput. Process applications include pre-diffusion and pre-CVD cleans, post-etching cleans, wet etching, and rapid resist stripping.

 NS300+ HT delivers the high performance associated with TEL’s proven series of scrubbers, with a boost in production of up to 500 wph with the same small product footprint. A well-established platform for advanced frontside and backside cleaning, the product employs parallel wafer processing, offers brush and DIW spray options, a chemical rinse for higher particle removal efficiency with low damage, and industry- leading bevel edge cleaning.

 "With the CELLESTA -i, EXPEDIUS -i, NS300+ HT , and the Certas WING vapor phase processing products, TEL has developed the industry’s widest spectrum of high productivity surface preparation products necessary for today's next generation 300mm high volume manufacturing environments," said Steven Yoh, Vice President and General Manager of TEL’s SPSBU.